B.I.C TINNING SOLDER FLUX
WATER SOLUBLE SOLDER FLUX
FEATURES
- Non Spattering formula
- High Activity and Excellent Wetting
- VOC - Free
- Compatible with Most Base Metals
DESCRIPTION
Solder Flux is a water-based, high activity liquid flux designed to offer low - spattering and excellent wetting, even to difficult to solder parts.
It is formulated for a variety of electronic, electrical and industrial applications, including wire, cable, and terminal lead tinning and soldering, flat and round wire fabrication, and semiconductor and component lead tinning.
Tinning flux will solder:- copper, beryllium-copper, nickel, alloy 42, alloy 51, nickel, brass, some steels, and base metals.
The broad activity range of Solder Flux makes it an excellent choice for tin/lead, tin/silver, tin/bismuth, indium, and other solder alloy.
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