B.I.C COPPER TINNING SOLDER FLUX

 B.I.C TINNING SOLDER FLUX

WATER SOLUBLE SOLDER FLUX

FEATURES

• Non Spattering formula
• High Activity and Excellent Wetting
• VOC - Free
• Compatible with Most Base Metals

DESCRIPTION

Solder Flux is a water-based, high activity liquid flux designed to offer low - spattering and excellent wetting, even to difficult to solder parts.

It is formulated for a variety of electronic, electrical and industrial applications, including wire, cable, and terminal lead tinning and soldering, flat and round wire fabrication, and semiconductor and component lead tinning. 

Tinning flux will solder:- copper, beryllium-copper, nickel, alloy 42, alloy 51, nickel, brass, some steels, and base metals.

The broad activity range of Solder Flux makes it an excellent choice for tin/lead, tin/silver, tin/bismuth, indium, and other solder alloy.

APPLICATION

B.I.C LEAD FREE (PB- FREE) SOLDER WIRE RANGE

 B.I.C LEAD FREE SOLDER WIRE RANGE

WIRE RATIO 

 99.3/0.7  Sn/Cu(Tin/Copper)

FLUX TYPES

1. Resin Core-                          (High Activity Solder wire)
2. No - Clean Core                      (High Activity Solder wire)
3. Halide / Halogen Free flux-          (High Activity Solder wire)
4. Halide Free flux-                    (High Activity Solder wire)

FLUX RATIO AVAILABLE

• 1.2%
• 1.8%
• 2.2%
• 2.5%
• 2.8%
• 3.0%

SWAGE AVAILABLE

• 16 SWG
• 18 SWG
• 20 SWG
• 21 SWG
• 22 SWG
• 24 SWG
• 26 SWG
• Solid Wire

MOST ADVANCED B.I.C ANTI DROSS POWDER FORMULATION FOR SOLDER RECOVERY

B.I.C NEW ADVANCED ANTI DROSS FORMULATION

REDUCE SOLDER DROSS FORMATION UPTO 90%.

Potent application of Anti Dross Powder is to cut the contact of solder with air/oxygen.

It is used in solder bath/Pot while Dip Soldering Process.

Performance of Anti Dross is maximum when tin content in solder is higher.

How to Choose the Correct Solder as per Application

How to identify the best suitable Solder Quality

Lets start with basics of Solder composition available in the market like we have solder in the combination of Tin (SN), Lead (PB), Copper (CU) and Silver (AG).

Normal Tin/Lead Solder ratios commonly used are (SN/PB): 10/90, 15/85, 20/80, 25/75, 30/70, 35/65, 40/60, 45/55, 50/50, 55/45, 60/40 and 63/37. 

These are also referred as Leaded Solder Qualities.

Now the days consciousness related to environment and human health have increased thus companies have started using ROHS , NON-Leaded Solder Wires with their application, usually governed by European Norms and used by exporting companies in their products and by MNC's.

Normal Lead-Free Solder wire composition available are Tin/Copper (SN/CU), Tin/Silver/Copper in the ratio of 99.3/0.7 (SN/CU), 99/1 (SN/CU). 99/0.3/0.7 (SN/AG/CU) and 96.5/3/0.5 (SN/AG/CU) aka SAC 305.

SAC 307 also primarily used these days 96.3/3/0.7.

Today, with technological advancement and to reduce cost Antimonial, bismuth containing solder are produced which are hard and have high melting temperature thus doesn't suit every application but are economical than normal silver containing solder wires.

There are many factors that determine the choice of suitable solder quality:

B.I.C Magic Solder Flux Paste

 B.I.C Magic Solder Flux Paste

ROSIN BASED SOLDER FLUX PASTE IS USED IN VARIOUS ELECTRICAL AND ELECTRONIC APPLICATION WHERE SOLDERING IS REQUIRED TO BE DONE ON COPPER/NICKEL/MILD STEEL AND OTHER METALS.

OUR SOLDER FLUX PASTE IS MULTI-PURPOSE SOFT PASTE WITH MID BROWN COLOR TEXTURE CONTAINING ZINC CHLORIDE AND WORKS ON MANY METALS SURFACES..

New Innovation Updates

Odor-Less Solder Smoke Technology

Improvements:      

With our endeavor to continuously provide our valuable customers with more efficient and cost effective Solder products, we engage in on-going researches to improve our product quality in varied ways to not only cater the customer current needs but unmet needs which are generally not expected by general users of solder products.

We take opportunity to highlight the following updates in your purchased Solder Wire:

1.    Odor-less Solder Smoke not harming engineer health due to specific smell in the normal solder wires while soldering.

2.    Increased Solder Flow helping the user achieve high efficiency and increased per psc production.

3.    Low Post Soldering Residues

4.    Easy to clean residues post soldering.