B.I.C LEAD FREE (PB- FREE) SOLDER WIRE RANGE

 B.I.C LEAD FREE SOLDER WIRE RANGE

WIRE RATIO 

 99.3/0.7  Sn/Cu(Tin/Copper)

FLUX TYPES

1. Resin Core-                          (High Activity Solder wire)
2. No - Clean Core                      (High Activity Solder wire)
3. Halide / Halogen Free flux-          (High Activity Solder wire)
4. Halide Free flux-                    (High Activity Solder wire)

FLUX RATIO AVAILABLE

• 1.2%
• 1.8%
• 2.2%
• 2.5%
• 2.8%
• 3.0%

SWAGE AVAILABLE

• 16 SWG
• 18 SWG
• 20 SWG
• 21 SWG
• 22 SWG
• 24 SWG
• 26 SWG
• Solid Wire

TECHNICAL DETAILS

• Melting temperature - 200*C
• Soldering temperature - 380*C
• Lead content - less than 500 PPM
• ROHS compliant
• Easy to clean residues
• colorless residues , less smoke and environment friendly residues

 

Contact us for Purchase.

Best Regards,

B.I.C Solder Team

BAJAJ INSULATION CO. MANUFACTURERS SOLDER WIRE, SOLDER STICKS, SOLDER FLUXES, PCB CLEANING SOLVENTS, DIP SOLDERING MACHINES, TIN-COPPER WIRE, TIN-ZINC WIRE AND ALLIED CHEMICALS IN DELHI.